Quality_思锐创优

Comprehensive testing process

All products undergo a strict multi-step inspection process that ensures our customers only receive genuine and functional electronic components.

Preliminary detection

Maker's Part Number
Quantity
Factory
Date code
Batch number
ROHS and MSL
Physical state
Packaging
Bar code verification

Deep into the project

Phase 1 verification
Detection results
Using a high-power microscope
Inspection of components
Anti-counterfeiting inspection
Dimension inspection
Electrical performance tests/
Verifying the circuit value of the capacitor
Chip surface
Chemical reagent test
Acetone test
Take a photo and record
in the database

Advanced detection

D-CAP Open Cap Test
X-ray test
Performance test
Baking

Strict quality management

Sri Youchuang adheres to the principle of quality first in all aspects of its business, and is constantly improving its quality structure,
and continuously integrates new technologies, processes, and training into the quality control system, providing customers with a safe supply chain guarantee.

Total quality management
Quality requirements for the whole process
Quality awareness for all
Authoritative quality certification

Quality awareness for all

SIERRA SUPERIOR promotes its anti-counterfeiting capabilities and cybersecurity awareness through the implementation of its quality policy and quality system training, to meet customer requirements and their future needs and expectations.

Detection tools& detection equipment

Shirui has invested in a series of testing equipment and tools to support our quality inspectors to identify the most subtle defects and the most complex counterfeit parts in advance.

X-RAY

X-RAY makes use of the property that X-rays generated by high voltage impacting the target can penetrate most objects. Our inspection engineers can clearly observe the internal structure of the chip, as well as the welding quality of various types of SMT weld points, without damaging the inspection samples. This allows us to verify whether there are any problems with the components, and to eliminate inferior and counterfeit components.
Solderability test equipment

The principle of the wetting balance method is used to qualitatively and quantitatively evaluate the weldability of components, PCB boards, pads, solder, and flux, etc.
D-CAP

The packaging shell of the chip is removed by using chemical reagents method or laser etching to check the original factory identification, layout, process defects, etc. on the surface of the grain.
Visual inspection equipment

Carry out visual inspection of the chip to determine if there are any cracks, damage, or other abnormal phenomena on the chip's appearance.